Rigorous modeling and analysis of impact produced by microstructures in mask on wafer pattern fidelity

Irina Pundaleva; Roman Chalykh; MyoungSoo Lee; HeeBom Kim; ByungGook Kim; HanKu Cho

doi:10.1117/12.773203

7 March 2008 Rigorous modeling and analysis of impact produced by microstructures in mask on wafer pattern fidelity

Irina Pundaleva, Roman Chalykh, MyoungSoo Lee, HeeBom Kim, ByungGook Kim, HanKu Cho

Proceedings Volume 6924, Optical Microlithography XXI; 69244H (2008) https://doi.org/10.1117/12.773203
Event: SPIE Advanced Lithography, 2008, San Jose, California, United States

Abstract

As feature size continuously decreasing new techniques to improve quality of wafer are developed. Hence a lot of new problems in semiconductor industry arise. Strict control of quality of wafer during production process is very important as many factors can influence on it, but the main contribution gives scanner error and mask. Thus at least impact of mask should be reduced. In this work we apply rigorous model to predict impact of microstructures to pattern fidelity on wafer. Such microstructures are commonly generated in quartz layer to control transmittance distribution on photomask. It is shown that effect from microstructures is not only changing of mask transmittance but also distortion of the pattern fidelity on wafer. Rigorous modeling gives us possibility to calculate aerial image and CD on wafer in case of presence of microstructures in the quartz. We vary optical parameters, such as refractive indexes, number, size and location of these elements in order to reduce the distortion of pattern fidelity on wafer. Our result allows prediction of the impact of microstructures in photomask on wafer pattern fidelity instead of doing set of experiments. Moreover, the best conditions for experiment are found and discussed.

Citation Download Citation

Irina Pundaleva, Roman Chalykh, MyoungSoo Lee, HeeBom Kim, ByungGook Kim, and HanKu Cho "Rigorous modeling and analysis of impact produced by microstructures in mask on wafer pattern fidelity", Proc. SPIE 6924, Optical Microlithography XXI, 69244H (7 March 2008); https://doi.org/10.1117/12.773203

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available