Film thickness measurement tool with a stress measurement function

Masahiro Horie; Kumiko Akashika; Shuji Shiota; Shinji Yamaguchi; Kakumichi Yamano

doi:10.1117/12.772416

25 March 2008 Film thickness measurement tool with a stress measurement function

Masahiro Horie, Kumiko Akashika, Shuji Shiota, Shinji Yamaguchi, Kakumichi Yamano

Proceedings Volume 6922, Metrology, Inspection, and Process Control for Microlithography XXII; 692235 (2008) https://doi.org/10.1117/12.772416
Event: SPIE Advanced Lithography, 2008, San Jose, California, United States

Abstract

A shrinking design rule has decreased film thickness specifications and is creating challenges as multi-layer structures and new materials are introduced. We have developed a spectroscopic ellipsometer, the RE-5200, which can measure several parameters with spot sizes down to 30 um. The advantages of the RE-5200 include high long-term stability, high accuracy, short measurement time, and low COO. The high precision aspheric mirrors were developed specifically for this system and allow the measurement of very small areas on the device. In addition, the stress measurement function meets some of the latest demands, which are high throughput, high accuracy and pattern independent. This paper presents the optical design and performance of the RE-5200, including measurement results.

Citation Download Citation

Masahiro Horie, Kumiko Akashika, Shuji Shiota, Shinji Yamaguchi, and Kakumichi Yamano "Film thickness measurement tool with a stress measurement function", Proc. SPIE 6922, Metrology, Inspection, and Process Control for Microlithography XXII, 692235 (25 March 2008); https://doi.org/10.1117/12.772416

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