Defect inspection using a high-resolution pattern image obtained from multiple low-resolution images of the same pattern on an observed noisy SEM image

Masahiko Takashima; Yoshihiro Midoh; Koji Nakamae

doi:10.1117/12.772513

24 March 2008 Defect inspection using a high-resolution pattern image obtained from multiple low-resolution images of the same pattern on an observed noisy SEM image

Masahiko Takashima, Yoshihiro Midoh, Koji Nakamae

Author Affiliations +

Proceedings Volume 6922, Metrology, Inspection, and Process Control for Microlithography XXII; 692216 (2008) https://doi.org/10.1117/12.772513
Event: SPIE Advanced Lithography, 2008, San Jose, California, United States

Abstract

In this paper, we propose a novel defect inspection method by considering the advantage that the same pattern is repeatedly transferred onto a large number of areas in resist pattern fabrication. This approach consists of following two steps. The first step is to obtain a high-resolution pattern image from multiple low-resolution images of the same pattern on an observed noisy SEM image using a reconstruction-based super-resolution technique where the B-spline interpolation is utilized. It can reconstruct a high-resolution image from the low resolution and noisy images with a high degree of accuracy. The next step is to inspect defects by comparing the high-resolution pattern image with lowresolution images to be verified. We applied our method to model and SEM images to show its validity.

Citation Download Citation

Masahiko Takashima, Yoshihiro Midoh, and Koji Nakamae "Defect inspection using a high-resolution pattern image obtained from multiple low-resolution images of the same pattern on an observed noisy SEM image", Proc. SPIE 6922, Metrology, Inspection, and Process Control for Microlithography XXII, 692216 (24 March 2008); https://doi.org/10.1117/12.772513

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