Full automatic packaging of a hybrid transceiver module

Felix Frischkorn; Joern Miesner; Sebastian Glass

doi:10.1117/12.768353

8 February 2008 Full automatic packaging of a hybrid transceiver module

Felix Frischkorn, Joern Miesner, Sebastian Glass

Proceedings Volume 6899, Photonics Packaging, Integration, and Interconnects VIII; 689908 (2008) https://doi.org/10.1117/12.768353
Event: Integrated Optoelectronic Devices 2008, 2008, San Jose, California, United States

Abstract

System integrators are driven by the demands of hybrid module manufacturers to provide machines with a higher degree of system integration while maintaining full process automation at max. throughput and yield. The full automated packaging process involves Pick&Place of several components like photo diode, laser sub-mount, integrated optical chip and PCB. Whereby some components are placed passively supported by vision inspection and some are aligned actively by closing a control loop on nano-scale precision. The system applies adhesive bonding for fixation of the components. The presentation shows how various assembly steps are combined in one machine concept for assembling and qualifying complex hybrid modules. Therefore modern assembly machines relay to special hardware designs i.e. for trays, chucks, motion concepts and calibration systems as well as for software features as data base interfaces, recipe controlled processes and flexible process editor. However beside hardware and software feasibility also necessary device characterisation is an important feature in assembly machines.

Citation Download Citation

Felix Frischkorn, Joern Miesner, and Sebastian Glass "Full automatic packaging of a hybrid transceiver module", Proc. SPIE 6899, Photonics Packaging, Integration, and Interconnects VIII, 689908 (8 February 2008); https://doi.org/10.1117/12.768353

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