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A three-dimensional (3-D) 4×4×4 optical interconnect Mesh network scheme for parallel multiprocessor system based
on polymer light waveguide electro-optical printed circuit board(EOPCB) is proposed in this paper. The Mesh
topological structures of light waveguide interconnects for processor element chip-to-chip on a board, and board-toboard
on backplane is constructed. The system consists of 64 processor element chips interconnected in a 3-D Mesh
network configuration. Every processor board comprises 4x4 processor element chips with Mesh interconnection.
Board-to-board Mesh interconnects are established on a backplane through light waveguide Mesh interconnect
topological structure. An additional optical layer with light waveguide structure is used in conventional PCB to construct
EOPCB. Vertical cavity surface emitting laser (VCSEL) array is used as optical transmitter array. PIN photodiode array
is used as optical receiver array. A MT-compatible direct coupling method is presented to couple light beam between
optical transmitter/receiver with light waveguide layer. The optical signals from a processor element chip on a board can
transmit to another processor element chip on another board through light waveguide interconnection in the backplane.
So 3-D optical interconnection Mesh network for parallel multiprocessor system can be reailzed by EOPCB.
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Fengguang Luo, Mingcui Cao, Xinjun Zhou, Jun Xu, Zhixiang Luo, Jing Yuan, Liangjia Zong, Yonghua Feng, Chao Chen, Conghui Zhang, "3D optical interconnect mesh network for on-board parallel multiprocessor system based on EOPCB," Proc. SPIE 6795, Second International Conference on Space Information Technology, 67954V (10 November 2007); https://doi.org/10.1117/12.774982