Paper
30 October 2007 The study of CD error in mid-local pattern area caused by develop loading effect
Man-Kyu Kang, Jung-Hun Lee, Seong-Yoon Kim, Byung-Gook Kim, Sang-Gyun Woo, Han-Ku Cho
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Abstract
As the design rule has decreased in semiconductor manufacturing, the ITRS roadmap requires significantly tighter critical dimension control. Especially, CD error caused by develop loading become significant in the overall error budget and has approached to over 5nm. It is very difficult to control dissolution product making the change of dissolution rate by chemical flow direction in develop process. These days, the study of develop loading within global area has significantly progressed. However, we will focus on CD error in mid-local area by using a detailed analysis. And we evaluate these phenomenon caused by pattern density difference, called chemical flare. Even though using several developer types, CD error appears at the chip to chip boundary. It is impossible to correct CD error in this area by electron beam correction. Therefore, this paper analyzed about CD error in a value of several tens ~ hundreds nm. In view of develop loading, we will optimize develop process for improvement of CD error.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Man-Kyu Kang, Jung-Hun Lee, Seong-Yoon Kim, Byung-Gook Kim, Sang-Gyun Woo, and Han-Ku Cho "The study of CD error in mid-local pattern area caused by develop loading effect", Proc. SPIE 6730, Photomask Technology 2007, 67300H (30 October 2007); https://doi.org/10.1117/12.746565
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Cited by 3 scholarly publications.
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KEYWORDS
Critical dimension metrology

Photoresist developing

Photoresist materials

Error analysis

Chemical analysis

Photoresist processing

Photomasks

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