Optimizing surface finishing processes through the use of novel solvents and systems

M. Quillen; P. Holbrook; J. Moore

doi:10.1117/12.713407

5 April 2007 Optimizing surface finishing processes through the use of novel solvents and systems

M. Quillen, P. Holbrook, J. Moore

Proceedings Volume 6518, Metrology, Inspection, and Process Control for Microlithography XXI; 651841 (2007) https://doi.org/10.1117/12.713407
Event: SPIE Advanced Lithography, 2007, San Jose, California, United States

Abstract

As the semiconductor industry continues to implement the ITRS (International Technology Roadmap for Semiconductors) node targets that go beyond 45nm [1], the need for improved cleanliness between repeated process steps continues to grow. Wafer cleaning challenges cover many applications such as Cu/low-K integration, where trade-offs must be made between dielectric damage and residue by plasma etching and CMP or moisture uptake by aqueous cleaning products. [2-5] Some surface sensitive processes use the Marangoni tool design [6] where a conventional solvent such as IPA (isopropanol), combines with water to provide improved physical properties such as reduced contact angle and surface tension. This paper introduces the use of alternative solvents and their mixtures compared to pure IPA in removing ionics, moisture, and particles using immersion bench-chemistry models of various processes. A novel Eastman proprietary solvent, Eastman methyl acetate is observed to provide improvement in ionic, moisture capture, and particle removal, as compared to conventional IPA. [7] These benefits may be improved relative to pure IPA, simply by the addition of various additives. Some physical properties of the mixtures were found to be relatively unchanged even as measured performance improved. This report presents our attempts to cite and optimize these benefits through the use of laboratory models.

Citation Download Citation

M. Quillen, P. Holbrook, and J. Moore "Optimizing surface finishing processes through the use of novel solvents and systems", Proc. SPIE 6518, Metrology, Inspection, and Process Control for Microlithography XXI, 651841 (5 April 2007); https://doi.org/10.1117/12.713407

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available