Paper
20 March 2007 Requirements and potentialities of packaging for bioreactors with LTCC and polymer
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Abstract
The main focus of this article lies on the development of a novel joining technology for LTCC ceramic and polymer sub-assemblies utilising laser radiation. Technical processes and the latest results are presented as well as potential future applications. The developed joining process can be divided into two steps utilizing the same laser system: a surface modification of the joining partners and a thermal process that is melting a small portion of the polymer matrix that is being pressed into the roughness of the ceramic surface.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Udo Klotzbach, Volker Franke, Frank Sonntag, Lothar Morgenthal, and Eckhard Beyer "Requirements and potentialities of packaging for bioreactors with LTCC and polymer", Proc. SPIE 6459, Laser-based Micro- and Nanopackaging and Assembly, 645902 (20 March 2007); https://doi.org/10.1117/12.702206
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CITATIONS
Cited by 2 scholarly publications.
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KEYWORDS
Polymers

Ceramics

Sensors

Polymeric sensors

Pulsed laser operation

Nd:YAG lasers

Lab on a chip

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