Fabrication of embedded conductive layer in polymer by plasma immersion ion implantation

Peter C. T. Ha; Z. J. Han; B. K. Tay

doi:10.1117/12.695666

22 December 2006 Fabrication of embedded conductive layer in polymer by plasma immersion ion implantation

Peter C. T. Ha, Z. J. Han, B. K. Tay

Proceedings Volume 6413, Smart Materials IV; 64130V (2006) https://doi.org/10.1117/12.695666
Event: SPIE Smart Materials, Nano- and Micro-Smart Systems, 2006, Adelaide, Australia

Abstract

Plasma immersion ion implantation (PIII) offers an alternative to ion beam with the advantage of high implantation rate. However, problems inherent to the application of PIII to non-conducting materials such as polymers are due to surface charging. To overcome these difficulties and to have a controllable implantation depth, we sputtered a thin layer of gold before PIII is applied to the polymer substrate. The result is a controllable implantation dept and stronger adhesion between the metal-polymer interfaces. The extent of implantation depth can be correlated to tribological properties, electrical conductivity and Raman spectroscopy. While conductive AFM confirmed the conductivity of the embedded layer, the future applications, difficulties and limitations using this technique for fabrication of conductive embedded layer in polymers are also discussed.

Citation Download Citation

Peter C. T. Ha, Z. J. Han, and B. K. Tay "Fabrication of embedded conductive layer in polymer by plasma immersion ion implantation", Proc. SPIE 6413, Smart Materials IV, 64130V (22 December 2006); https://doi.org/10.1117/12.695666

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