High-speed high-accuracy fiber optic low-coherence interferometry for in situ grinding and etching process monitoring

Wojciech J. Walecki; Alexander Pravdivtsev; Manuel Santos II; Ann Koo

doi:10.1117/12.675592

14 August 2006 High-speed high-accuracy fiber optic low-coherence interferometry for in situ grinding and etching process monitoring

Wojciech J. Walecki, Alexander Pravdivtsev, Manuel Santos II, Ann Koo

Author Affiliations +

Proceedings Volume 6293, Interferometry XIII: Applications; 62930D (2006) https://doi.org/10.1117/12.675592
Event: SPIE Optics + Photonics, 2006, San Diego, California, United States

Abstract

We present design of novel tool for characterization of wafer thickness and wafer topography employing fast low coherence fiber optic interferometer, which optical length of the reference arm of the interferometer is monitored by secondary long coherence length interferometer.

Citation Download Citation

Wojciech J. Walecki, Alexander Pravdivtsev, Manuel Santos II, and Ann Koo "High-speed high-accuracy fiber optic low-coherence interferometry for in situ grinding and etching process monitoring", Proc. SPIE 6293, Interferometry XIII: Applications, 62930D (14 August 2006); https://doi.org/10.1117/12.675592

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