Paper
18 May 2006 Dual band adaptive focal plane array: an example of the challenge and potential of intelligent integrated microsystems
William J. Gunning, Jeffrey DeNatale, Philip Stupar, Robert Borwick, Stefan Lauxterman, Paul Kobrin, John Auyeung
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Abstract
Creating intelligent integrated microsystems, devices that incorporate photonics, electronics, MEMS, and embedded intelligence, presents multiple challenges. The three device technologies have been largely developed independently and have established their own sets of design and process rules that have led to highly stable, high yield processes. In combining these technologies to achieve a desired functionality, constraints are placed on each technology to avoid adverse impacts on the others. Finding a common path towards achieving a single end objective requires process reoptimization and the development of new processes. This paper discusses the dual band adaptive focal plane array (AFPA) that is currently under development, with an emphasis on technology integration and the resulting functional benefits that can be realized. The AFPA device is a dual band IR imaging sensor that enables simultaneous collection of high-resolution MWIR imagery, with spatially independent spectrally tuned imaging in the LWIR for enhanced target detection and classification.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
William J. Gunning, Jeffrey DeNatale, Philip Stupar, Robert Borwick, Stefan Lauxterman, Paul Kobrin, and John Auyeung "Dual band adaptive focal plane array: an example of the challenge and potential of intelligent integrated microsystems", Proc. SPIE 6232, Intelligent Integrated Microsystems, 62320F (18 May 2006); https://doi.org/10.1117/12.669724
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Cited by 6 scholarly publications.
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KEYWORDS
Microelectromechanical systems

Mirrors

Optical filters

Long wavelength infrared

Sensors

Mid-IR

Staring arrays

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