Paper
31 March 2006 Nickel electrodeposition studies for high-aspect-ratio microstructure fabrication for MEMS
Author Affiliations +
Abstract
This work investigates both DC and pulse electroplating techniques for nickel. A nickel sulfamate electrolyte is utilized for nickel deposition over Cu/Ti coated silicon substrates. Stress levels and grain morphology are investigated and analyzed for the electroplated nickel deposit. A comparison is also made between the results obtained from DC and from long and short duration pulse electroplating techniques. Both compressive and tensile built-in stresses are observed in both DC and long duration pulse plated nickel while only compressive stresses are observed in short duration pulse plated nickel.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Tinghui Xin and Pratul K. Ajmera "Nickel electrodeposition studies for high-aspect-ratio microstructure fabrication for MEMS", Proc. SPIE 6172, Smart Structures and Materials 2006: Smart Electronics, MEMS, BioMEMS, and Nanotechnology, 61720E (31 March 2006); https://doi.org/10.1117/12.659104
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Nickel

Plating

Electroplating

Electrodes

Microelectromechanical systems

Silicon

Scanning electron microscopy

Back to Top