Study on LD-pumped Nd:YAG laser cutter

Jianfeng Cui; Jing Zhao; Zhongwei Fan; Cunhua Zhao; Yong Bi; Jing Zhang; Gang Niu; Zhaohui Shi; Bo Pei; Guoxin Zhang; Yan Xue; Yan Qi

doi:10.1117/12.667348

16 January 2006 Study on LD-pumped Nd:YAG laser cutter

Jianfeng Cui, Jing Zhao, Zhongwei Fan, Cunhua Zhao, Yong Bi, Jing Zhang, Gang Niu, Zhaohui Shi, Bo Pei, Guoxin Zhang, Yan Xue, Yan Qi

Author Affiliations +

Proceedings Volume 6028, ICO20: Lasers and Laser Technologies; 60282F (2006) https://doi.org/10.1117/12.667348
Event: ICO20:Optical Devices and Instruments, 2005, Changchun, China

Abstract

The theory of laser cutter and the technology neck is analyzed. We can conclude that it is almost impossible to deal with the waste thick silicon wafers which are yielded in producing silicon wafers by conventional eroding or diamond cutting, while it is also unperfected with ecumenical laser cutter without good beam quality or precise laser and optics system. It is represented that high average power and high repetition rate laser with good beam quality and precise laser and optics system are pivotal to obtain excellent cutting effect such as thick groove depth, rapid cutting speed, fine kerf section without considering the effect of technique. Considering laser medium thermal lens effect and thermal focal length changing with pumping power, using plano-convex high reflectivity mirror as the back cavity mirror to compensate the heat lens influence, aλ/4 waveplate to compensate heat-induced birefraction, utilize the Nd:YAG self-aperture effect, more than 50 W average power 1.064 um IR output is obtained with beam quality factor (M²) equals 3.19. Through the LD-Pumped Nd:YAG laser cutter we developed with short focus length negative spherical aberration focusing lens, double axis linear step motor positioning system, suitable beam expander multiplying factor, appropriate diameter of exit beam aperture, proper repetition rate, when the cutting velocity equals 400mm/min, 0.75mm thick silicon wafer can be penetrated; when the cutting velocity equals 100mm/min, double-layer 0.75mm thick silicon wafer can be penetrated. The cross section is fine and the groove is narrow, the cutting quality meets the expecting demand.

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Jianfeng Cui, Jing Zhao, Zhongwei Fan, Cunhua Zhao, Yong Bi, Jing Zhang, Gang Niu, Zhaohui Shi, Bo Pei, Guoxin Zhang, Yan Xue, and Yan Qi "Study on LD-pumped Nd:YAG laser cutter", Proc. SPIE 6028, ICO20: Lasers and Laser Technologies, 60282F (16 January 2006); https://doi.org/10.1117/12.667348

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KEYWORDS

Silicon

Laser cutting

Semiconducting wafers

Semiconductor lasers

Nd:YAG lasers

Thermal effects

Laser applications

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