Determination of mask layer stress by placement metrology

Jörg Butschke; Ute Buttgereit; Eric Cotte; Günter Hess; Mathias Irmscher; Holger Seitz

doi:10.1117/12.631526

8 November 2005 Determination of mask layer stress by placement metrology

Jörg Butschke, Ute Buttgereit, Eric Cotte, Günter Hess, Mathias Irmscher, Holger Seitz

Proceedings Volume 5992, 25th Annual BACUS Symposium on Photomask Technology; 59923U (2005) https://doi.org/10.1117/12.631526
Event: SPIE Photomask Technology, 2005, Monterey, California, United States

Abstract

The present paper will show an approach for a local and global stress determination by the application of a Leica LMS IPRO II mask registration tool. Changes in placement due to a full or partial layer removal on single materials as well as material stacks with respect to a reference grid were determined. Simulation using finite element modeling was conducted to calculate stress values from the placement information. Finally, an estimate was made of the acceptable stress level for a sample design to meet placement requirements for future lithography nodes.

Citation Download Citation

Jörg Butschke, Ute Buttgereit, Eric Cotte, Günter Hess, Mathias Irmscher, and Holger Seitz "Determination of mask layer stress by placement metrology", Proc. SPIE 5992, 25th Annual BACUS Symposium on Photomask Technology, 59923U (8 November 2005); https://doi.org/10.1117/12.631526

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