FPA technology advancements at Rockwell Scientific

Tom Chuh

doi:10.1117/12.604169

31 May 2005 FPA technology advancements at Rockwell Scientific

Tom Chuh

Proceedings Volume 5783, Infrared Technology and Applications XXXI; (2005) https://doi.org/10.1117/12.604169
Event: Defense and Security, 2005, Orlando, Florida, United States

Abstract

Progress of selected FPA (Focal Plane Array) technology development at Rockwell Scientific Company is reviewed: very large format monolithic visible CMOS, hybrid silicon pin visible CMOS, ultra high frame rate (360ns interframe time) burst mode camera, substrate removed HgCdTe infrared detectors for continuous visible through infrared spectral sensitivity, astronomical focal plane arrays, mosaic (16 megapixel) infrared FPAs, JWST, and the SIDECAR ASIC readout interface chip.

Citation Download Citation

Tom Chuh "FPA technology advancements at Rockwell Scientific", Proc. SPIE 5783, Infrared Technology and Applications XXXI, (31 May 2005); https://doi.org/10.1117/12.604169

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