Paper
31 May 2005 35 μm pitch at ULIS, a breakthrough
C. Trouilleau, A. Crastes, O. Legras, J. L. Tissot, J. P. Chatard
Author Affiliations +
Abstract
This paper reviews ULIS’progress, on 35 μm pitch, in amorphous silicon uncooled microbolometer focal plane (UFPA) technology and product development over the last year. The ULIS FPA products have been described in great detail, including product capabilities and complete EO performances. At 60 Hz frame rate, focal planes with 40 mK (f/1) NETD are now achieved in production with a spatial fixed pattern noise lower than 25 mK after gain and offset compensation. Key improvements, compared to 45 μm pitch technology, have been the achievement of microbolometer resistance uniformity better than 0.5 % (standard deviation) on the IRFPA die for the different formats. Thanks to a new pixel design, high fill factor along with low thermal time constant (7 ms), 35 μm pitch amorphous silicon UFPAs are prime candidates for FLIR applications.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
C. Trouilleau, A. Crastes, O. Legras, J. L. Tissot, and J. P. Chatard "35 μm pitch at ULIS, a breakthrough", Proc. SPIE 5783, Infrared Technology and Applications XXXI, (31 May 2005); https://doi.org/10.1117/12.605336
Lens.org Logo
CITATIONS
Cited by 13 scholarly publications.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Sensors

Staring arrays

Amorphous silicon

Bolometers

Readout integrated circuits

Manufacturing

Microbolometers

Back to Top