Profile simulation of SU-8 thick film resist

Yoshihisa Sensu; Atsushi Sekiguchi; Satoshi Mori; Nao Honda

doi:10.1117/12.596856

4 May 2005 Profile simulation of SU-8 thick film resist

Yoshihisa Sensu, Atsushi Sekiguchi, Satoshi Mori, Nao Honda

Proceedings Volume 5753, Advances in Resist Technology and Processing XXII; (2005) https://doi.org/10.1117/12.596856
Event: Microlithography 2005, 2005, San Jose, California, United States

Abstract

XP SU-8 3000 (hereinafter referred to as “SU-8”) thick-film resist is a chemically amplified negative resist based on epoxy resin. Here, we report on the profile simulation for this resist. Profile simulation is an important technique for planning experiments. Thus, there have been many reports on simulation techniques. In particular, many studies have been conducted on chemically amplified positive resists, as they are major resist materials used in the IC industry. However, there have been few simulation studies concerning chemically amplified negative resists. Under these circumstances, we have considered performing simulations on chemically amplified negative resist. The results of the simulation and the SEM observations are in good agreement. This study demonstrates that simulation is possible for a chemically amplified negative resist (SU-8).

Citation Download Citation

Yoshihisa Sensu, Atsushi Sekiguchi, Satoshi Mori, and Nao Honda "Profile simulation of SU-8 thick film resist", Proc. SPIE 5753, Advances in Resist Technology and Processing XXII, (4 May 2005); https://doi.org/10.1117/12.596856

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