Encapsulation of light emitting materials and photo-patterning using B-cyclodextrin

Jin-Baek Kim; Ji-Young Park

doi:10.1117/12.600269

4 May 2005 Encapsulation of light emitting materials and photo-patterning using B-cyclodextrin

Jin-Baek Kim, Ji-Young Park

Proceedings Volume 5753, Advances in Resist Technology and Processing XXII; (2005) https://doi.org/10.1117/12.600269
Event: Microlithography 2005, 2005, San Jose, California, United States

Abstract

By using inclusion chemistry, low-molecular-weight organic materials such as 8-hydroxy-quinoline derivative-metal complexes (ZnQ2, AlQ3) were encapsulated by t-butyloxycarbonyloxy (t-BOC)-protected β-cyclodextrin to increase their processibility and to protect them against atmospheric environment. Since the products showed increased solubility in common organic solvents such as tetrahydrofuran, methylenechloride, and chloroform, they could be processed by solution method like spin-coating. Their absorbance and emission spectra were nearly the same compared to their unmodified coordinated complex. By using deprotection reactions of t-BOC groups, these materials were patterned by a simple photolithographic process.

Citation Download Citation

Jin-Baek Kim and Ji-Young Park "Encapsulation of light emitting materials and photo-patterning using B-cyclodextrin", Proc. SPIE 5753, Advances in Resist Technology and Processing XXII, (4 May 2005); https://doi.org/10.1117/12.600269

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