Low thermal expansion substrate material for EUVL components application

Kousuke Nakajima; Toshihide Nakajima; Yoshiyuki Owari

doi:10.1117/12.598392

6 May 2005 Low thermal expansion substrate material for EUVL components application

Kousuke Nakajima, Toshihide Nakajima, Yoshiyuki Owari

Proceedings Volume 5751, Emerging Lithographic Technologies IX; (2005) https://doi.org/10.1117/12.598392
Event: Microlithography 2005, 2005, San Jose, California, United States

Abstract

The material capability of CLEARCERAM-Z series for EUVL components (Mask, Mirror and Structural application) was investigated. Data for an existing specification and key characteristics for each application were collected and the material performances were evaluated. For mask substrate application, the inter lot and intra block CTE uniformity to meet Class A in SEMI P37 standard with a statistical confidence, and the surface roughness & flatness to meet the SEMI specifications were demonstrated for CLEARCERAM-Z HS. For mirror application, the size availability up to Dia.780mm and the material uniformity equivalent to optical glass were confirmed for CLEARCERAM-Z HS products. Also ion beam figuring results showed a linear removal controllability by processing time and no practical change in the base line profile in mid spatial frequency roughness region of the post figured surface. For structure application, demonstrative processing tests by utilizing possible techniques to produce the structural components for EUVL were done. In the R&D activities for new materials, advantageous improvements on CTE stability over temperature and smoother surface finish than conventional CLEARCERAM-Z series were presented with a material uniformity equivalent to the conventional products.

Citation Download Citation

Kousuke Nakajima, Toshihide Nakajima, and Yoshiyuki Owari "Low thermal expansion substrate material for EUVL components application", Proc. SPIE 5751, Emerging Lithographic Technologies IX, (6 May 2005); https://doi.org/10.1117/12.598392

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