Paper
12 April 2005 Analysis of femtosecond (775nm) and nanosecond (355nm) micromachined Ni surfaces using electron backscatter diffraction (EBSD) (Invited Paper)
William O'Neill, Matt Gill, Walter Perrie, Peter Fox, D. Prior
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Abstract
Advances in laser micromachining have resulted in considerable processing capabilities for the growing MEMS/MOMS applications currently being developed. The two distinct temporal regimes for processing that are employed currently are ultrafast timescales at ~150fs and nanosecond timescales at >5 < 250ns. Reported results from various laser interaction studies reveal that the absence of heat affected zones cannot be guaranteed when using ultrafast interactions. This work presents experimental results from ablation studies of Ni in the ns and fs regimes. An important processing parameter, average scanned intensity, is defined along with experimentally derived values for ablation thresholds and the 2ω0 beam diameter for each of the optical setups. We apply electron back scattering diffraction (EBSD) analysis to target machined Ni surfaces from the fs and ns interactions to identify the creation or absence heat affected zones. Results from the study of EBSD data suggest that low intensity ultrafast interactions are capable of eliminating heat affected zones on condition that surface plasmas are not sustained above the interaction site. There is clear evidence of substantial heat affected zones when using nanosecond pulses at a wavelength of 355nm.
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William O'Neill, Matt Gill, Walter Perrie, Peter Fox, and D. Prior "Analysis of femtosecond (775nm) and nanosecond (355nm) micromachined Ni surfaces using electron backscatter diffraction (EBSD) (Invited Paper)", Proc. SPIE 5713, Photon Processing in Microelectronics and Photonics IV, (12 April 2005); https://doi.org/10.1117/12.598484
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KEYWORDS
Nickel

Femtosecond phenomena

Ultrafast phenomena

Diffraction

Crystals

Laser ablation

Laser processing

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