In Situ Resolution and Overlay Measurement on a Stepper

T. A. Brunner; R. R. Allen

doi:10.1117/12.949726

2 January 1986 In Situ Resolution and Overlay Measurement on a Stepper

T. A. Brunner, R. R. Allen

Proceedings Volume 0565, Micron and Submicron Integrated Circuit Metrology; (1986) https://doi.org/10.1117/12.949726
Event: 29th Annual Technical Symposium, 1985, San Diego, United States

Abstract

A direct means of observing both the location and the shape of the aerial image of a microlithographic stepper lens is described. Sub-micron resist structures, doped with a fluorescent dye, are swept through the aerial image as fluorescence is monitored. The resolution of this technique is not limited by optical wavelengths, but rather depends on the width of the fluorescent resist structures. Data are reported on the resolution and overlay error of a 5X reduction stepper. 60 hertz vibrational motions of the projected image with respect to the wafer were observed with peak to peak amplitudes as large as 0.3 microns.

Citation Download Citation

T. A. Brunner and R. R. Allen "In Situ Resolution and Overlay Measurement on a Stepper", Proc. SPIE 0565, Micron and Submicron Integrated Circuit Metrology, (2 January 1986); https://doi.org/10.1117/12.949726

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