Thickness measurement of thin transparent plates with a broadband wavelength-scanning interferometer

Pasquale Maddaloni; Giuseppe Coppola; Paolo de Natale; Sergio de Nicola; Pietro Ferraro; Mariano Gioffre; Mario Iodice

doi:10.1117/12.544955

17 August 2004 Thickness measurement of thin transparent plates with a broadband wavelength-scanning interferometer

Pasquale Maddaloni, Giuseppe Coppola, Paolo de Natale, Sergio de Nicola, Pietro Ferraro, Mariano Gioffre, Mario Iodice

Proceedings Volume 5458, Optical Micro- and Nanometrology in Manufacturing Technology; (2004) https://doi.org/10.1117/12.544955
Event: Photonics Europe, 2004, Strasbourg, France

Abstract

A novel broad-band telecom laser source is used to realize a lateral-shear scanning-wavelength interferometer for measuring the thickness of thin plates. We show that the wide tunability range allows to detect samples down to tens of microns with a relative uncertainty of less than 0.5% and a resolution of about 1 nm. A comparable accuracy in the thickness characterization of double-layer structures is also demonstrated. In turn, the wide tunability range needs the dispersion law of the materials to be taken into account in the model for correct thickness evaluation.

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Pasquale Maddaloni, Giuseppe Coppola, Paolo de Natale, Sergio de Nicola, Pietro Ferraro, Mariano Gioffre, and Mario Iodice "Thickness measurement of thin transparent plates with a broadband wavelength-scanning interferometer", Proc. SPIE 5458, Optical Micro- and Nanometrology in Manufacturing Technology, (17 August 2004); https://doi.org/10.1117/12.544955

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KEYWORDS

Refractive index

Interferometers

Silicon

Laser sources

Collimation

Fringe analysis

Interferometry

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