Dissolution Kinetics Of E-Beam Resists

David S. Soong

doi:10.1117/12.947807

18 April 1985 Dissolution Kinetics Of E-Beam Resists

David S. Soong

Proceedings Volume 0539, Advances in Resist Technology and Processing II; (1985) https://doi.org/10.1117/12.947807
Event: 1985 Microlithography Conferences, 1985, Santa Clara, United States

Abstract

A brief overview of a model for the dissolution of resists is given. The glassy film is first converted into a swollen gel, whereupon entangled coils disengage from the network into the developer solution. The glass/gel interface movement is governed by stress-induced Case II diffusion, whereas polymer dissociation from the gel-like network at the gel/solvent interface is best described by a reptation type process. Transient stress and concentration profiles between these two moving boundaries provide a link between the interface kinetics. Polymer molecular weight, polymer-solvent compatibility, free volume state of the glassy matrix, and diffusivity of the solvent in the gel layer are all properly reflected in the basic scheme of the model. Preliminary results exhibit behavior consistent with experimental observations using an in-situ psi-meter. Effects of individual process parameters on the final structure will be explored in a future publication detailing comparison of full model predictions and systematic experimental data.

Citation Download Citation

David S. Soong "Dissolution Kinetics Of E-Beam Resists", Proc. SPIE 0539, Advances in Resist Technology and Processing II, (18 April 1985); https://doi.org/10.1117/12.947807

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