Effects of crosslinking, prestrain, and dielectric filler on the electromechanical response of a new silicone and comparison with acrylic elastomer

Xuequn Zhang; M. Wissler; B. Jaehne; Rolf Breonnimann; Gabor Kovacs

doi:10.1117/12.540888

27 July 2004 Effects of crosslinking, prestrain, and dielectric filler on the electromechanical response of a new silicone and comparison with acrylic elastomer

Xuequn Zhang, M. Wissler, B. Jaehne, Rolf Breonnimann, Gabor Kovacs

Author Affiliations +

Proceedings Volume 5385, Smart Structures and Materials 2004: Electroactive Polymer Actuators and Devices (EAPAD); (2004) https://doi.org/10.1117/12.540888
Event: Smart Structures and Materials, 2004, San Diego, CA, United States

Abstract

Silicone and acrylic elastomers have received increased attention as dielectric electroactive polymer (EAP) materials for actuator technology. The goal of this work was to develop and characterize a new class of silicones (DC3481) and to compare it with acrylic elastomers. The influence of various types of hardeners, hardener concentration, prestrain and high dielectric organic fillers was studied by mechanical, electrical and electromechanical experiments. Furthermore the temperature dependence and the viscoelastic properties were investigated. The results show that by changing type and concentration of hardener, the Young's modulus can be varied. In order to increase the dielectric constant, the silicone was blended with organic materials. Compared to acrylic elastomers, this new class of silicone elastomers has the advantage of a constant stiffness over a wide range of temperature and a lower viscosity that results in a higher response speed of the actuator.

Citation Download Citation

Xuequn Zhang, M. Wissler, B. Jaehne, Rolf Breonnimann, and Gabor Kovacs "Effects of crosslinking, prestrain, and dielectric filler on the electromechanical response of a new silicone and comparison with acrylic elastomer", Proc. SPIE 5385, Smart Structures and Materials 2004: Electroactive Polymer Actuators and Devices (EAPAD), (27 July 2004); https://doi.org/10.1117/12.540888

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