Paper
23 December 2003 Electrothermal actuator reliability studies
Author Affiliations +
Abstract
Shallow V type symmetric electrothermal actuators which have a central shuttle and overall lengths of ~610 μm, leg widths between 3 and 4.5 μm, and offset angles between 0.7 and 2.3° have been subjected to short term, high stress drive currents under different environmental conditions. For all the devices and all test conditions, ~200 mW power levels lead to plastic deformation both for DC actuation and square wave modulation at the limit of the device’s bandwidth. Also, it is noted that under vacuum conditions the hottest portions of the surface roughen significantly and there is significant discoloration of the silicon nitride under the device. SEM analysis of cleaved surfaces of these vacuum actuated devices shows significant near surface pitting.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Richard A. Plass, Michael S. Baker, and Jeremy A. Walraven "Electrothermal actuator reliability studies", Proc. SPIE 5343, Reliability, Testing, and Characterization of MEMS/MOEMS III, (23 December 2003); https://doi.org/10.1117/12.530936
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CITATIONS
Cited by 8 scholarly publications.
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KEYWORDS
Actuators

Thermal modeling

Reliability

Scanning electron microscopy

Silicon

Photomicroscopy

Resistance

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