Paper
17 December 2003 EUV radiation damage test on EUVL mask absorber materials
Bing Lu, James R. Wasson, Sang-In Han, Pawitter Mangat, Victoria Golovkina, Franco Cerrina
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Abstract
We have studied the EUV mask absorber stack materials stability under extended EUV radiation exposure using the Synchrotron facility located at Aladdin Synchrotron Radiation Center of UW-Madison. The DUV reflectivity was measured at the area where the absorber stack was exposed to EUV radiation for different period of time to understand the impact on mask inspection during use and potential radiation damage. The longest exposure time simulated 2 million EUV exposure shots based on the resist sensitivity of 5 mJ/cm2. After EUV radiation, a significant increase in DUV reflectivity was observed. However, this change may be due to the hydrocarbon contamination from the EUV exposure chamber because an obvious darkening was observed on the exposed area and could be easily removed by a short O2 plasma etching. The experimental data showed that reflectivity was restored after O2 plasma etching and the difference was less than 2%. X-ray photoelectron spectroscopy (XPS) and forward recoil spectrometry also used for the confirmation of hydrocarbon build up during exposure.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Bing Lu, James R. Wasson, Sang-In Han, Pawitter Mangat, Victoria Golovkina, and Franco Cerrina "EUV radiation damage test on EUVL mask absorber materials", Proc. SPIE 5256, 23rd Annual BACUS Symposium on Photomask Technology, (17 December 2003); https://doi.org/10.1117/12.517972
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KEYWORDS
Extreme ultraviolet lithography

Reflectivity

Extreme ultraviolet

Hydrogen

Deep ultraviolet

Inspection

Plasma enhanced chemical vapor deposition

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