Investigation of silicon MEMS structures subjected to thermal loading by digital holography

Pietro Ferraro; Sergio De Nicola; Andrea Finizio; Giuseppe Coppola; Mario Iodice; Simonetta Grilli; Carlo Magro; Giovanni Pierattini

doi:10.1117/12.500657

3 October 2003 Investigation of silion MEMS structures subjected to thermal loading by digital holography

Pietro Ferraro, Sergio De Nicola, Andrea Finizio, Giuseppe Coppola, Mario Iodice, Simonetta Grilli, Carlo Magro, Giovanni Pierattini

Author Affiliations +

Proceedings Volume 5145, Microsystems Engineering: Metrology and Inspection III; (2003) https://doi.org/10.1117/12.500657
Event: Optical Metrology, 2003, Munich, Germany

Abstract

In this paper we study silicon MEMS (Microelectromechanical systems) structures subjected to thermal loading. Digital holography has been investigated as inspection tool to evaluate the deformation induced by the thermal loading. Application of DH on structures with several different geometries and shapes, like cantilever beams, bridges and membranes is reported and result will be discussed. Dimensions of the inspected microstructures, varies in the range 1÷50μm. The experimental results shown that a "bimorph-effect" induces a deformation in MEMS structures. The difficulties encountered in performing the deformation analysis by digital holography in real-time will be afforded and discussed. A method with automatic focus tracking in Digital Holography is proposed allowing inspection of MEMS, under thermal loading, in real-time.

Citation Download Citation

Pietro Ferraro, Sergio De Nicola, Andrea Finizio, Giuseppe Coppola, Mario Iodice, Simonetta Grilli, Carlo Magro, and Giovanni Pierattini "Investigation of silion MEMS structures subjected to thermal loading by digital holography", Proc. SPIE 5145, Microsystems Engineering: Metrology and Inspection III, (3 October 2003); https://doi.org/10.1117/12.500657

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