Thermal management in high-power electronics cooled down using capillary pump

Boguslaw Wiecek; Tomasz Wajman; Mariola Felczak; Marek Berlinski

doi:10.1117/12.503889

1 April 2003 Thermal management in high-power electronics cooled down using capillary pump

Boguslaw Wiecek, Tomasz Wajman, Mariola Felczak, Marek Berlinski

Proceedings Volume 5073, Thermosense XXV; (2003) https://doi.org/10.1117/12.503889
Event: AeroSense 2003, 2003, Orlando, Florida, United States

Abstract

By using the evaporation of working fluid in the capillary it is possible to design and build cooling device, with high cooling effectiveness. This paper presents a preliminary cooling system integrated with electronic device., which is supported by evaporation and capillarity effects. A simplified modeling of conjugate heat transfer including evaporation using FLUENT package is discussed. The experiments for open and close loop capillary pomp are shown to compare and verify the measurements and simulation results.

Citation Download Citation

Boguslaw Wiecek, Tomasz Wajman, Mariola Felczak, and Marek Berlinski "Thermal management in high-power electronics cooled down using capillary pump", Proc. SPIE 5073, Thermosense XXV, (1 April 2003); https://doi.org/10.1117/12.503889

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