Design and simulation of a bulk micromachined relay with lateral contact

Zhenchuan Yang; Zhihong Li; Yilong Hao; Guoying Wu

doi:10.1117/12.483185

10 September 2002 Design and simulation of a bulk micromachined relay with lateral contact

Zhenchuan Yang, Zhihong Li, Yilong Hao, Guoying Wu

Proceedings Volume 4928, MEMS/MOEMS Technologies and Applications; (2002) https://doi.org/10.1117/12.483185
Event: Photonics Asia, 2002, Shanghai, China

Abstract

A bulk micromachined relay with lateral contact structure is presented in this paper. The relay is fabricated with glass/silicon wafer bonding and deep reactive ion etching (DRIE) process. it is laterally driven with electrostatic actuator. The threshold voltage of the relay is simulated using Reduced Order Modeling (ROM) methods provided by a general finite element simulator, ANSYSTM. The simulated result and experimental result are compared and discussed

Citation Download Citation

Zhenchuan Yang, Zhihong Li, Yilong Hao, and Guoying Wu "Design and simulation of a bulk micromachined relay with lateral contact", Proc. SPIE 4928, MEMS/MOEMS Technologies and Applications, (10 September 2002); https://doi.org/10.1117/12.483185

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available