Performance of vinyl ether cross-linkers on resist for 193-nm lithography

JongSoo Lee; Hideo Suzuki; Keisuke Odoi; Nobukazu Miyagawa; Shigeru Takahara; Tsuguo Yamaoka

doi:10.1117/12.474254

24 July 2002 Performance of vinyl ether cross-linkers on resist for 193-nm lithography

JongSoo Lee, Hideo Suzuki, Keisuke Odoi, Nobukazu Miyagawa, Shigeru Takahara, Tsuguo Yamaoka

Proceedings Volume 4690, Advances in Resist Technology and Processing XIX; (2002) https://doi.org/10.1117/12.474254
Event: SPIE's 27th Annual International Symposium on Microlithography, 2002, Santa Clara, California, United States

Abstract

A three-component positive working resist composed of an acrylate polymer, vinyl ether cross-linker, and photoacid generator was evaluated for vacuum UV lithography. The vinyl ether cross-linker using tricyclodecyl group of alicyclic compound has a high transparency. This resist system shows a relatively high sensitivity and has a good profiling by irradiation using 193 nm light from an ArF excimer laser. Moreover, we found that these cross-linking type resists have advantages with respect to its resist properties such as the acid diffusion and the dry etching resistance.

Citation Download Citation

JongSoo Lee, Hideo Suzuki, Keisuke Odoi, Nobukazu Miyagawa, Shigeru Takahara, and Tsuguo Yamaoka "Performance of vinyl ether cross-linkers on resist for 193-nm lithography", Proc. SPIE 4690, Advances in Resist Technology and Processing XIX, (24 July 2002); https://doi.org/10.1117/12.474254

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