Paper
16 July 2002 Alternative approach for direct APC using scatterometry data
Boaz Brill, Yoel Cohen, Igor Turovets, Dario Elyasy, Tzevi Beatus
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Abstract
Scatterometry is a promising method, capable of providing accurate profile information for a large range of applications. However, applying scatterometry to the production environment and applying it to APC is still difficult. In this paper we propose an alternative approach in which we apply a Neural Network to directly correlate scatterometry raw data and the lithography process control parameters. The proposed method is much easier to use than normal scatterometry, and can therefore be applied to APC much faster.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Boaz Brill, Yoel Cohen, Igor Turovets, Dario Elyasy, and Tzevi Beatus "Alternative approach for direct APC using scatterometry data", Proc. SPIE 4689, Metrology, Inspection, and Process Control for Microlithography XVI, (16 July 2002); https://doi.org/10.1117/12.473521
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KEYWORDS
Scatterometry

Semiconducting wafers

Process control

Finite element methods

Diffraction

Lithography

Neural networks

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