PROCEEDINGS VOLUME 4652
SYMPOSIUM ON INTEGRATED OPTOELECTRONIC DEVICES | 19-25 JANUARY 2002
Optoelectronic Interconnects, Integrated Circuits, and Packaging
Editor(s): Louay A. Eldada, Randy A. Heyler, John R. Rowlette Sr., John R. Rowlette Sr., Randy A. Heyler
Editor Affiliations +
IN THIS VOLUME

6 Sessions, 29 Papers, 0 Presentations, 0 Posters
Section  (17)
SYMPOSIUM ON INTEGRATED OPTOELECTRONIC DEVICES
19-25 January 2002
San Jose, California, United States
Highly Integrated OEICs
Proceedings Volume Optoelectronic Interconnects, Integrated Circuits, and Packaging, (2002) https://doi.org/10.1117/12.469555
Proceedings Volume Optoelectronic Interconnects, Integrated Circuits, and Packaging, (2002) https://doi.org/10.1117/12.469564
Antonije M. Radojevic, Junichiro Fujita, Louay A. Eldada
Proceedings Volume Optoelectronic Interconnects, Integrated Circuits, and Packaging, (2002) https://doi.org/10.1117/12.469572
OEICs for WDM Applications
Manijeh Razeghi, Steven Slivken
Proceedings Volume Optoelectronic Interconnects, Integrated Circuits, and Packaging, (2002) https://doi.org/10.1117/12.469578
John C. Cartledge, Shao-chun Cao
Proceedings Volume Optoelectronic Interconnects, Integrated Circuits, and Packaging, (2002) https://doi.org/10.1117/12.469579
Hybrid Integration for OEICs
Toshikazu Hashimoto, Ikuo Ogawa
Proceedings Volume Optoelectronic Interconnects, Integrated Circuits, and Packaging, (2002) https://doi.org/10.1117/12.469580
Hans Joachim Heider, Stefan Wiechmann, Matthias Mahnke, Joerg Mueller
Proceedings Volume Optoelectronic Interconnects, Integrated Circuits, and Packaging, (2002) https://doi.org/10.1117/12.469581
Proceedings Volume Optoelectronic Interconnects, Integrated Circuits, and Packaging, (2002) https://doi.org/10.1117/12.469582
OEICs for Next-Generation Optical Interconnects
Shogo Ura
Proceedings Volume Optoelectronic Interconnects, Integrated Circuits, and Packaging, (2002) https://doi.org/10.1117/12.469583
Poster Session
Hee-Hyun Lee, Sung-Jae Jung, Heung-Soo Kim, Doo-Gun Kim, Young-Wan Choi
Proceedings Volume Optoelectronic Interconnects, Integrated Circuits, and Packaging, (2002) https://doi.org/10.1117/12.469556
OEICs for Next-Generation Optical Interconnects
Proceedings Volume Optoelectronic Interconnects, Integrated Circuits, and Packaging, (2002) https://doi.org/10.1117/12.469557
Section
Eddie Wills, John Brajkovich, James Bauer
Proceedings Volume Optoelectronic Interconnects, Integrated Circuits, and Packaging, (2002) https://doi.org/10.1117/12.469558
Yuwen Chen, Chee Leong Tan, Boon Siew Ooi, Kaladhar Radhakrishnan, Geok Ing Ng
Proceedings Volume Optoelectronic Interconnects, Integrated Circuits, and Packaging, (2002) https://doi.org/10.1117/12.469559
Wenning Liu, Yaomin Lin, Frank G. Shi
Proceedings Volume Optoelectronic Interconnects, Integrated Circuits, and Packaging, (2002) https://doi.org/10.1117/12.469560
Ting Chen, Weldon Royall Cox, Diana Lenhard, Donald J. Hayes
Proceedings Volume Optoelectronic Interconnects, Integrated Circuits, and Packaging, (2002) https://doi.org/10.1117/12.469561
Roberto Galeotti, Mark Shaw, Maurizio Musio, Marcello Tienforti, Giacomo Coppo
Proceedings Volume Optoelectronic Interconnects, Integrated Circuits, and Packaging, (2002) https://doi.org/10.1117/12.469562
Angelamaria Groppi, Mark Shaw
Proceedings Volume Optoelectronic Interconnects, Integrated Circuits, and Packaging, (2002) https://doi.org/10.1117/12.469563
Masahiro Uekawa, Hironori Sasaki, Daisuke Shimura, Kyoko Kotani, Yoshinori Maeno, Takeshi Takamori
Proceedings Volume Optoelectronic Interconnects, Integrated Circuits, and Packaging, (2002) https://doi.org/10.1117/12.469565
Nina Zhang, Frank Vodhanel, Martin Hagenbuechle
Proceedings Volume Optoelectronic Interconnects, Integrated Circuits, and Packaging, (2002) https://doi.org/10.1117/12.469566
Lucia Marazzi, Paola Parolari, Igor Toscani, Mario Martinelli
Proceedings Volume Optoelectronic Interconnects, Integrated Circuits, and Packaging, (2002) https://doi.org/10.1117/12.469567
Serge Oktyabrsky, James Castracane, Alain E. Kaloyeros
Proceedings Volume Optoelectronic Interconnects, Integrated Circuits, and Packaging, (2002) https://doi.org/10.1117/12.469568
Proceedings Volume Optoelectronic Interconnects, Integrated Circuits, and Packaging, (2002) https://doi.org/10.1117/12.469569
Hyung-Soo Kim, Sung-Jae Jung, Hee-Hyun Lee, Doo-Gun Kim, Young-Wan Choi
Proceedings Volume Optoelectronic Interconnects, Integrated Circuits, and Packaging, (2002) https://doi.org/10.1117/12.469570
Proceedings Volume Optoelectronic Interconnects, Integrated Circuits, and Packaging, (2002) https://doi.org/10.1117/12.469571
Proceedings Volume Optoelectronic Interconnects, Integrated Circuits, and Packaging, (2002) https://doi.org/10.1117/12.469573
Proceedings Volume Optoelectronic Interconnects, Integrated Circuits, and Packaging, (2002) https://doi.org/10.1117/12.469574
Michael J. Laha
Proceedings Volume Optoelectronic Interconnects, Integrated Circuits, and Packaging, (2002) https://doi.org/10.1117/12.469575
OEICs for WDM Applications
Vishal Saxena
Proceedings Volume Optoelectronic Interconnects, Integrated Circuits, and Packaging, (2002) https://doi.org/10.1117/12.469576
Section
Proceedings Volume Optoelectronic Interconnects, Integrated Circuits, and Packaging, (2002) https://doi.org/10.1117/12.469577
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