Thin films residual stress measurement by optical profilometry

Manuel Filipe M. Costa

doi:10.1117/12.447335

30 October 2001 Thin films residual stress measurement by optical profilometry

Manuel Filipe M. Costa

Proceedings Volume 4596, Advanced Photonic Sensors and Applications II; (2001) https://doi.org/10.1117/12.447335
Event: International Symposium on Photonics and Applications, 2001, Singapore, Singapore

Abstract

The study of intrinsic stress in PVD thin films is rather important because it is related to the films' to substrate adherence, and influences the coated component during service. Stress is strongly induced during the film growth process that is controlled by the deposition parameters. The residual stress of the as-deposited PVD coatings causes bending of the coating/substrate system. If residual stresses are present, but the overall detection is small compared with the substrate thickness, then by symmetry the coated substrate will take up a spherical curvature in the region away from the edges. In this communication we will report on our work on residual stress evaluation of different kinds of thin films, by profilometric optical inspection of the film/substrate system. The inspection system we used, the MICROTOP.06.MFC, is an active optical triangulation sensor developed by the author at the Universidade do Minho. It allows depth resolutions down to 7 nm and lateral resolutions down to 1 )mum.

Citation Download Citation

Manuel Filipe M. Costa "Thin films residual stress measurement by optical profilometry", Proc. SPIE 4596, Advanced Photonic Sensors and Applications II, (30 October 2001); https://doi.org/10.1117/12.447335

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