Influence of patterning geometry on the electrodeposition of microstructures fabricated by laser LIGA

Hengyi Jin; Sam T. Davies; Muralihar K. Ghantasala; Jason P. Hayes; Erol C. Harvey

doi:10.1117/12.449006

21 November 2001 Influence of patterning geometry on the electrodeposition of microstructures fabricated by laser LIGA

Hengyi Jin, Sam T. Davies, Muralihar K. Ghantasala, Jason P. Hayes, Erol C. Harvey

Proceedings Volume 4592, Device and Process Technologies for MEMS and Microelectronics II; (2001) https://doi.org/10.1117/12.449006
Event: International Symposium on Microelectronics and MEMS, 2001, Adelaide, Australia

Abstract

This paper describes recent experimental studies on the effect of patterning geometry on the laser machining parameters and electrodeposition rate of nickel microstructures fabricated using laser LIGA. The effect of shape, size and spacing of features has been studied for structures plated into Laminar AX moulds. In contrast to previous work, which has concentrated on low aspect ratio (< 0.1) geometries or on large (> 1 mm) structures, we specifically address here problems relating to aspect ratios in the range 0.14 - 8.75 and feature sizes of ~ 4 micrometers to 200 micrometers . Mould structures and plated features have been examined using optical, scanning electron and laser scanning confocal microscopy. Results show that for features >50 micrometers , the thickness profile of plated shapes varies by approximately +/- 1 micrometers m over most of the surface area with the edges demonstrating corner rounding with a radius ~ 5 micrometers . Below 20 micrometers in size, thickness profiles become peaked towards the center of a feature. A surface roughness (Ra) of ~ 1.0 micrometers is also observed. The reduction in deposition rate over the 3 hour electroforming process has also been explained in terms of an increase in plating area due to the profile of the laser ablated moulds.

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Hengyi Jin, Sam T. Davies, Muralihar K. Ghantasala, Jason P. Hayes, and Erol C. Harvey "Influence of patterning geometry on the electrodeposition of microstructures fabricated by laser LIGA", Proc. SPIE 4592, Device and Process Technologies for MEMS and Microelectronics II, (21 November 2001); https://doi.org/10.1117/12.449006

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KEYWORDS

Nickel

Electroplating

Optical lithography

Plating

Copper

Laser ablation

Polymers

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