Paper
21 November 2001 Development of a systematic recipe set for processing SU8-5 photoresist
Deng-Huei Hwang, Yi-Chung Lo, Kanping Chin
Author Affiliations +
Proceedings Volume 4592, Device and Process Technologies for MEMS and Microelectronics II; (2001) https://doi.org/10.1117/12.448958
Event: International Symposium on Microelectronics and MEMS, 2001, Adelaide, Australia
Abstract
In the current study, a systematic recipe set was developed for processing SU8-5 photoresist in order to fabricate a microaccelerometer with high-aspect-ratio structure by UV-LIGA process. The disclosed recipe set comprises a series of relative recipes for processing SU8-5, including spin speed, soft bake, exposure dose, post exposure bake and developing time. The recipe set is capable of processing SU8-5 film with thickness from 5micrometers to 80micrometers . General hot plate, Karl Suess Gyrset spinner RC8 CT62 (spin coater) and MJB3 exposure aligner which all belongs to the frequently adopted equipments in the traditional IC fab, were used to explore these recipes. To verify these recipes, the SU8-5 micromold fabricated according to the presented recipe set is employed to electroplate the structure of the biaxial microaccelerometer with critical dimension of 4x20x500micrometers . The detail and most effective process parameters described in this systematic recipe set promote the beginner to process SU8-5 and fabricate the SU8-5 micromold. In addition, various failure reasons due to adopting the improper recipes are also discussed to provide the guide line for the reader to develop and approach their own proper recipe to process SU8-5.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Deng-Huei Hwang, Yi-Chung Lo, and Kanping Chin "Development of a systematic recipe set for processing SU8-5 photoresist", Proc. SPIE 4592, Device and Process Technologies for MEMS and Microelectronics II, (21 November 2001); https://doi.org/10.1117/12.448958
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Cited by 3 scholarly publications.
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KEYWORDS
Photoresist developing

Photoresist materials

Semiconducting wafers

Polymers

Coating

Electroplating

Silicon

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