Trie representation for expressing the compatibility between items in a logical bill of material structure

Naken Wongvasu; Stefan Pittner; Sagar V. Kamarthi; Ibrahim Zeid

doi:10.1117/12.443118

3 October 2001 Trie representation for expressing the compatibility between items in a logical bill of material structure

Naken Wongvasu, Stefan Pittner, Sagar V. Kamarthi, Ibrahim Zeid

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Proceedings Volume 4565, Intelligent Systems in Design and Manufacturing IV; (2001) https://doi.org/10.1117/12.443118
Event: Intelligent Systems and Advanced Manufacturing, 2001, Boston, MA, United States

Abstract

This paper presents a new technique which uses a tree for constraining the compatibility among components in a logical bill of material (BOM) structure. The new representation for restricting possible combinations of components is designed to address the limitations of matrix representations that were used for the same purpose in earlier work. These matrix representations, which assume that the compatibility in a BOM can always be described for pairs of components, cannot be used for products in which the compatibility among three or more components is an issue. Thus, it is proposed to use a standard tree with a special representation, which is called a trie, to represent the compatibility between the components in a product configuration. Similar to the inter-component compatibility matrix, the trie can be used to validate and/or complete an arbitrary product configuration during the configuration process without having to spell out product configuration rules. The new representation provides the user with a means to describe all possible compatibility relationships with a limited amount of data. This trie representation is comprehensive, easy to maintain, and easy to understand.

Citation Download Citation

Naken Wongvasu, Stefan Pittner, Sagar V. Kamarthi, and Ibrahim Zeid "Trie representation for expressing the compatibility between items in a logical bill of material structure", Proc. SPIE 4565, Intelligent Systems in Design and Manufacturing IV, (3 October 2001); https://doi.org/10.1117/12.443118

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