Development of advanced micromirror arrays by flip-chip assembly

M. Adrian Michalicek; Victor M. Bright

doi:10.1117/12.443105

2 October 2001 Development of advanced micromirror arrays by flip-chip assembly

M. Adrian Michalicek, Victor M. Bright

Proceedings Volume 4561, MOEMS and Miniaturized Systems II; (2001) https://doi.org/10.1117/12.443105
Event: Micromachining and Microfabrication, 2001, San Francisco, CA, United States

Abstract

This paper presents the design, commercial prefabrication, modeling and testing of advanced micromirror arrays fabricated using a novel, simple and inexpensive flip-chip assembly technique. Several polar piston arrays and rectangular cantilever arrays were fabricated using flip-chip assembly by which the upper layers of the array are fabricated on a separate chip and then transferred to a receiving module containing the lower layers. Typical polar piston arrays boast 98.3% active surface area, highly planarized surfaces, low address potentials compatible with CMOS electronics, highly standardized actuation between devices, and complex segmentation of mirror surfaces which allows for custom aberration configurations. Typical cantilever arrays boast large angles of rotation as well as an average surface planarity of only 1.779 nm of RMS roughness across 100 +m mirrors. Continuous torsion devices offer stable operation through as much as six degrees of rotation while binary operation devices offer stable activated positions with as much as 20 degrees of rotation. All arrays have desirable features of costly fabrication services like five structural layers and planarized mirror surfaces, but are prefabricated in the less costly MUMPs process. Models are developed for all devices and used to compare empirical data.

Citation Download Citation

M. Adrian Michalicek and Victor M. Bright "Development of advanced micromirror arrays by flip-chip assembly", Proc. SPIE 4561, MOEMS and Miniaturized Systems II, (2 October 2001); https://doi.org/10.1117/12.443105

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