Measurement of warpage of electronic packaging after machining by phase-shifting shadow moire method

Wei-Chung Wang; Yu-Wen Liu

doi:10.1117/12.468812

29 May 2002 Measurement of warpage of electronic packaging after machining by phase-shifting shadow moire method

Wei-Chung Wang, Yu-Wen Liu

Proceedings Volume 4537, Third International Conference on Experimental Mechanics; (2002) https://doi.org/10.1117/12.468812
Event: Third International Conference on Experimental Mechanics, 2002, Beijing, China

Abstract

In this paper, phase-shifting moire method was employed to investigate the machining effect on the warpage of electronic packagings undergone thermal cycles. Four types of machined slots were tested and compared with the unmachined one. It was found that they all give significant improvement on the warpage. However, the crossed type slot gives the largest reduction of warpage.

Citation Download Citation

Wei-Chung Wang and Yu-Wen Liu "Measurement of warpage of electronic packaging after machining by phase-shifting shadow moire method", Proc. SPIE 4537, Third International Conference on Experimental Mechanics, (29 May 2002); https://doi.org/10.1117/12.468812

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