Advances in light curing adhesives

Andy Bachmann

doi:10.1117/12.447301

5 November 2001 Advances in light curing adhesives

Andy Bachmann

Proceedings Volume 4444, Optomechanical Design and Engineering 2001; (2001) https://doi.org/10.1117/12.447301
Event: International Symposium on Optical Science and Technology, 2001, San Diego, CA, United States

Abstract

This paper describes the development of a new family of light curing adhesives containing a new reactive additive previously not used in optical grade light curing adhesives are obtained with the addition of functionalized cellulositics. Outgassing as low as 10^-6 grams/gram has been observed based on headspace sampling. Other additives have lowered the shrinkage rates of positioning adhesives from near 1 percent to less than 0.1 percent with fractional, percentage movements over thermal range of -40 degrees C to +200 degrees C.

Citation Download Citation

Andy Bachmann "Advances in light curing adhesives", Proc. SPIE 4444, Optomechanical Design and Engineering 2001, (5 November 2001); https://doi.org/10.1117/12.447301

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