Paper
25 February 2002 High-speed microvia formation with UV solid state lasers
Author Affiliations +
Proceedings Volume 4426, Second International Symposium on Laser Precision Microfabrication; (2002) https://doi.org/10.1117/12.456885
Event: Second International Symposium on Laser Precision Micromachining, 2001, Singapore, Singapore
Abstract
Laser drilling has emerged in the last five years as the most widely accepted method of creating microvias in high- density electronic inter connect and chip packaging devices. Most commercially available laser drilling tools are currently based on one of two laser types: far-IR CO2 lasers and UV solid state lasers at 355 nm. While CO2 lasers are recognized for their high average power and drilling throughput, UV lasers are known for high precision material removal and their ability to drill the smallest vias, with diameters down to about 25-30 micrometers now achievable in production. This paper presents a historical overview of techniques for drilling microvias with UV solid state lasers. Blind and through via formation by percussion drilling, trepanning, spiralling, and image projection with a shaped beam are discussed. Advantages and range of applicability of each technique are summarized. Drivers of throughput scaling over the last five years are outlined and representative current-generation performance is presented.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Corey M. Dunsky, Hisashi Matsumoto, and Glenn Simenson "High-speed microvia formation with UV solid state lasers", Proc. SPIE 4426, Second International Symposium on Laser Precision Microfabrication, (25 February 2002); https://doi.org/10.1117/12.456885
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Cited by 8 scholarly publications.
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KEYWORDS
Laser drilling

Ultraviolet radiation

Copper

Beam shaping

Solid state lasers

Carbon dioxide lasers

Laser applications

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