Improvement of temperature uniformity during prebake process in mask blank production

Bernd Beier; Fredi Schubert; Ute Buttgereit; Andreas Bensberg

doi:10.1117/12.425078

9 April 2001 Improvement of temperature uniformity during prebake process in mask blank production

Bernd Beier, Fredi Schubert, Ute Buttgereit, Andreas Bensberg

Proceedings Volume 4349, 17th European Conference on Mask Technology for Integrated Circuits and Microcomponents; (2001) https://doi.org/10.1117/12.425078
Event: 17th European Conference on Mask Technology for Integrated Circuits and Microcomponents, 2000, Munich, Germany

Abstract

The development in microlithography is focused on realization of feature sizes below 0.18 micrometers . This requires the reduction of defect size and density as well as the enhancement of CD performance. In blank production the CD uniformity is mainly influenced by resist thickness uniformity and temperature uniformity during prebake. This poster evaluates the impact of prebake process on CD performance. Best CD values are 10 nm range presently. Looking on the bake process of ZEP7000 at 200 degree(s)C a temperature difference of 1 K leads to a CD variation of 3.5 nm up to 7.9 nm. The work investigates the influence of an open and a semi open hotplate configuration on the blank surface temperature distribution during prebake process.

Citation Download Citation

Bernd Beier, Fredi Schubert, Ute Buttgereit, and Andreas Bensberg "Improvement of temperature uniformity during prebake process in mask blank production", Proc. SPIE 4349, 17th European Conference on Mask Technology for Integrated Circuits and Microcomponents, (9 April 2001); https://doi.org/10.1117/12.425078

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