Paper
4 April 2001 Precise angle measurement technique for a vertical microstructure on substrate
Hoseong Kim, Jinhwan Ko
Author Affiliations +
Proceedings Volume 4301, Machine Vision Applications in Industrial Inspection IX; (2001) https://doi.org/10.1117/12.420905
Event: Photonics West 2001 - Electronic Imaging, 2001, San Jose, CA, United States
Abstract
A novel technique that can measure the angle of a vertical microstructure with an accuracy of 0.05 degree(s) has been developed. The microstructure has a movable micromirror that is the main component of Micro-Optical Cross Connect (MOXC) that switches and couples optical signals in the optical communication networks. Since the performance of MOXC strongly depends on the angle between the vertical micromirror and the substrate, it is very important to measure the angle with high resolution better than 0.05 degree(s). In order to get the side view of the microstructure, a microscope imaging system that employs a long working distance objective lens and CCD camera has been built.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hoseong Kim and Jinhwan Ko "Precise angle measurement technique for a vertical microstructure on substrate", Proc. SPIE 4301, Machine Vision Applications in Industrial Inspection IX, (4 April 2001); https://doi.org/10.1117/12.420905
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KEYWORDS
Micromirrors

Image processing

CCD cameras

Microscopes

Algorithm development

Imaging systems

Objectives

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