Paper
4 June 2001 Application of holographic interferometry for dynamic vibration analysis of subminiature mechanical components
Author Affiliations +
Proceedings Volume 4296, Practical Holography XV and Holographic Materials VII; (2001) https://doi.org/10.1117/12.429443
Event: Photonics West 2001 - Electronic Imaging, 2001, San Jose, CA, United States
Abstract
Holographic Interferometry has been successfully employed to characterize the materials and behavior of diverse types of structures under stress. Specialized variations of this technology have also been applied to define dynamic structural behavior. Such applications of holographic techniques offer some of the most effective methods of structural analysis and flaw identification available. This technology is nondestructive, real-time, and definitive in allowing the identification of structural and mechanical geometry as well as describing dynamic behavior under stress. Structures and materials can be analyzed with very low amplitude stress or excitation and the resultant data can be used to adjust the accuracy of mathematically derived structural models or as criteria for complete inspection and analysis programs, as well as in developmental analysis.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Harry Fein "Application of holographic interferometry for dynamic vibration analysis of subminiature mechanical components", Proc. SPIE 4296, Practical Holography XV and Holographic Materials VII, (4 June 2001); https://doi.org/10.1117/12.429443
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KEYWORDS
Holography

Holograms

Holographic interferometry

Finite element methods

Data modeling

Fringe analysis

Vibrometry

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