Paper
4 June 2001 Adhesives deliver low-shrink low-stress bonds and fast UV cure
Kyle T. Rhodes
Author Affiliations +
Abstract
Lower stress, higher quality assemblies as well as quantum increases in productivity are now possible with `new generation', light curing adhesives. This new technology makes obsolete the industry-accepted assumption that low strain requires slow curing UV adhesives, epoxies and cements. Curing in only seconds and without the need for secondary thermal cure, these new light curing adhesives produce laminates which are essentially strain-free, and edge bonds with shrinkage as low as 0.2%. This paper will compare and contrast these new adhesives with existing bonding technologies in typical applications. Included are comparisons between epoxies, UV curing mercaptoesters, and the new light curing Aerobic Acrylates, as well as the incorporation of adhesives into optical component design.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Kyle T. Rhodes "Adhesives deliver low-shrink low-stress bonds and fast UV cure", Proc. SPIE 4253, Optical Fibers and Sensors for Medical Applications, (4 June 2001); https://doi.org/10.1117/12.427913
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CITATIONS
Cited by 1 scholarly publication.
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KEYWORDS
Adhesives

Ultraviolet radiation

Lamps

Glasses

Epoxies

Floods

Metals

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