Microstructuring with 193-nm laser radiation

Lin Zhang; Qihong Lou; Yunrong Wei; Feng Huang

doi:10.1117/12.395735

18 August 2000 Microstructuring with 193-nm laser radiation

Lin Zhang, Qihong Lou, Yunrong Wei, Feng Huang

Proceedings Volume 4181, Challenges in Process Integration and Device Technology; (2000) https://doi.org/10.1117/12.395735
Event: Microelectronic Manufacturing, 2000, Santa Clara, CA, United States

Abstract

For flexible structuring of a great variety of materials such as polymers ceramics and glass materials, excimer laser radiation has turned out to be a particularly appropriate tool. The excimer laser etching enables the manufacturing of micro-holes and grooves in the micrometer range, as well as the production of complex 3D topographies. In this paper, the surface characteristics of polymer and glass are compared after been etched by 308nm and 197nm UV excimer lasers, the results show that the use of ArF laser allows processing a surface quality close to that of the optics and fabricating ridges about 2micrometers - width. Finally, a rotational mask system is proposed to generate Fresnel lens.

Citation Download Citation

Lin Zhang, Qihong Lou, Yunrong Wei, and Feng Huang "Microstructuring with 193-nm laser radiation", Proc. SPIE 4181, Challenges in Process Integration and Device Technology, (18 August 2000); https://doi.org/10.1117/12.395735

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