Paper
18 August 2000 Polymer UV-molding for micro-optical systems and O/E-integration
Peter Dannberg, Gunnar Mann, Lars Wagner, Andreas H. Braeuer
Author Affiliations +
Proceedings Volume 4179, Micromachining Technology for Micro-Optics; (2000) https://doi.org/10.1117/12.395684
Event: Micromachining and Microfabrication, 2000, Santa Clara, CA, United States
Abstract
The potential and limits of micromoulding technology for the wafer scale hybrid integration of micro-optic elements on top of arbitrary substrates like glass, Silicon, III/V-semiconductors by a process which is performed in a modified contact mask aligner. The elements are characterised by high precision and stability, temperature stable and precise pitch, index, homogeneity, uniformity across the wafer, and they fulfill additional requirements for a practical application (AR-coating, separation in a dicing saw). Additionally, the technology for a two- sided replication of elements has been developed. The precision of lens arrays fabricated by reflow and UV-moulding is investigated, and the high performance of these arrays in the collimation of fiber arrays is shown. Steps toward a wafer scale integration of lens arrays with vertical cavity surface emitting lasers (VCSELs) by locally selective replication are demonstrated.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Peter Dannberg, Gunnar Mann, Lars Wagner, and Andreas H. Braeuer "Polymer UV-molding for micro-optical systems and O/E-integration", Proc. SPIE 4179, Micromachining Technology for Micro-Optics, (18 August 2000); https://doi.org/10.1117/12.395684
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Cited by 37 scholarly publications.
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KEYWORDS
Polymers

Semiconducting wafers

Photomasks

Vertical cavity surface emitting lasers

Collimation

Optical alignment

Wafer-level optics

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