Paper
25 August 2000 Single-crystal micromachining using multiple fusion-bonded layers
Alan Brown, Garry O'Neill, Scott C. Blackstone
Author Affiliations +
Proceedings Volume 4174, Micromachining and Microfabrication Process Technology VI; (2000) https://doi.org/10.1117/12.396460
Event: Micromachining and Microfabrication, 2000, Santa Clara, CA, United States
Abstract
Multi-layer structures have been fabricated using Fusion bonding. The paper shows void free layers of between 2 and 100 microns that have been bonded to form multi-layer structures. Silicon layers have been bonded both with and without interfacial oxide layers.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Alan Brown, Garry O'Neill, and Scott C. Blackstone "Single-crystal micromachining using multiple fusion-bonded layers", Proc. SPIE 4174, Micromachining and Microfabrication Process Technology VI, (25 August 2000); https://doi.org/10.1117/12.396460
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CITATIONS
Cited by 6 scholarly publications.
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KEYWORDS
Micromachining

Oxides

Silicon

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