Paper
25 August 2000 Powder blasting as a three-dimensional microstucturing technology for MEMS applications
Eric Belloy, I. Zalunardo, Abdeljlail Sayah, Martin A. M. Gijs
Author Affiliations +
Proceedings Volume 4174, Micromachining and Microfabrication Process Technology VI; (2000) https://doi.org/10.1117/12.396467
Event: Micromachining and Microfabrication, 2000, Santa Clara, CA, United States
Abstract
We present powder blasting as a new technology for the realization of Micro Electro-Mechanical Systems (MEMS). The technique is base don the erosion of a masked substrate by a high velocity powder beam. We study the erosion rate of the process using glass wafers and introduce oblique powder blasting, where we vary the angle of incidence of the powder beam with respect tot the target surface. The oblique impact gives rise to particular side walls effects of micro patterned hole structures. We have applied this microfabrication method for various MEMS applications, like the realization of glass accelerometer beams, biological microsystems for the culture and characterization of living cells and ferrite-based miniaturized transformers for ultra- small power applications.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Eric Belloy, I. Zalunardo, Abdeljlail Sayah, and Martin A. M. Gijs "Powder blasting as a three-dimensional microstucturing technology for MEMS applications", Proc. SPIE 4174, Micromachining and Microfabrication Process Technology VI, (25 August 2000); https://doi.org/10.1117/12.396467
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KEYWORDS
Etching

Diamond

Photomasks

Nickel

Copper

Reactive ion etching

Oxygen

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