Surface preparation of EUVL mask substrate for multilayer coating by supersonic hydrocleaning technique

Naoya Hirano; Hiromasa Hoko; Eiichi Hoshino; Taro Ogawa; Akira Chiba; Hiromasa Yamanashi; Masashi Takahashi; Shinji Okazaki

doi:10.1117/12.392046

19 July 2000 Surface preparation of EUVL mask substrate for multilayer coating by supersonic hydrocleaning technique

Naoya Hirano, Hiromasa Hoko, Eiichi Hoshino, Taro Ogawa, Akira Chiba, Hiromasa Yamanashi, Masashi Takahashi, Shinji Okazaki

Author Affiliations +

Proceedings Volume 4066, Photomask and Next-Generation Lithography Mask Technology VII; (2000) https://doi.org/10.1117/12.392046
Event: Photomask and Next Generation Lithography Mask Technology VII, 2000, Kanagawa, Japan

Abstract

Extreme UV lithography (EUVL) is a promising process for patterning devices for the 70-nm technology node and below. In order to fabricate low-defect EUVL-mask blanks, two kinds of cleaning techniques have to be developed. One is for cleaning a substrate before deposition of the Mo/Si multi- layer, since particles on the substrate can induce phase defects by altering the periodicity of the multi-layer. The other is for cleaning finished masks. Since the material generally used for pellicles are not transparent to EUV light, EUVL masks will not have a pellicle. The surface of such masks needs to be kept very clean, because particles on the mask are easily transferred to a wafer. This paper describes a new particle removal techniques developed at the ASET SPC Lab, called supersonic hydrocleaning . It was used to clean substrates before deposition of the multi-layer, and its effectiveness was evaluated.

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Naoya Hirano, Hiromasa Hoko, Eiichi Hoshino, Taro Ogawa, Akira Chiba, Hiromasa Yamanashi, Masashi Takahashi, and Shinji Okazaki "Surface preparation of EUVL mask substrate for multilayer coating by supersonic hydrocleaning technique", Proc. SPIE 4066, Photomask and Next-Generation Lithography Mask Technology VII, (19 July 2000); https://doi.org/10.1117/12.392046

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