Feature integrity monitoring for process control using a CD SEM

John A. Allgair; Gong Chen; Stephen J. Marples; David M. Goodstein; John D. Miller; Frank Santos

doi:10.1117/12.386475

2 June 2000 Feature integrity monitoring for process control using a CD SEM

John A. Allgair, Gong Chen, Stephen J. Marples, David M. Goodstein, John D. Miller, Frank Santos

Proceedings Volume 3998, Metrology, Inspection, and Process Control for Microlithography XIV; (2000) https://doi.org/10.1117/12.386475
Event: Microlithography 2000, 2000, Santa Clara, CA, United States

Abstract

Rapidly accelerating technology roadmaps have put increased pressure on in-line process control. CDs measured by automated SEMs are a common element of in-line process control. However, CD measurements alone may not be enough in all cases for adequate process control. For instance, degradation of feature integrity that does not lead to out of control CDs in photo can lead to scrap after etch. The cost of scrap and loss of time to results associated with catching photo process drift with after etch inspection has forced the development of new tools to monitor feature integrity in the ADI CD inspection module. Likewise, partially closed vias that are not caught with etch CD inspection can have a negative impact on copper processes. We describe a feature integrity monitoring technique using an automated CD-SEM that occurs simultaneously with the CD measurement to monitor and detect process drift prior to out of control CD events. We further describe the implementation of this technique in a production environment.

Citation Download Citation

John A. Allgair, Gong Chen, Stephen J. Marples, David M. Goodstein, John D. Miller, and Frank Santos "Feature integrity monitoring for process control using a CD SEM", Proc. SPIE 3998, Metrology, Inspection, and Process Control for Microlithography XIV, (2 June 2000); https://doi.org/10.1117/12.386475

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